RPS Power Monitor Application
1. Wafer protection by particles
CVD Tool uses NF3 Gas for Remote Plasma Generator for Chamber Clean. However, most RPS can show the actual exhaustion power on the Monitor. In other words, it is not possible to confirm the damage due to particles with the naked eye or before the determination of whether or not Wafer Reject can be performed because the process progresses after an inappropriate Chamber Clean caused by an abnormal output Power due to the deterioration of RPS performance.
RPM (RPS Power Monitor) manages RPS power value in real time in order to prevent Process damage due to RPS performance deterioration, so that process accidents that progress after unsafe Clean can be prevented in advance.
1. Wafer protection by particles
CVD Tool uses NF3 Gas for Remote Plasma Generator for Chamber Clean. However, most RPS can show the actual exhaustion power on the Monitor. In other words, it is not possible to confirm the damage due to particles with the naked eye or before the determination of whether or not Wafer Reject can be performed because the process progresses after an inappropriate Chamber Clean caused by an abnormal output Power due to the deterioration of RPS performance.
RPM (RPS Power Monitor) manages RPS power value in real time in order to prevent Process damage due to RPS performance deterioration, so that process accidents that progress after unsafe Clean can be prevented in advance.
2. Process time improvement
RPS auto-controls the output power value according to the amount of NF3 gas, pressure, and temperature.
However, most RPS does not display the Power value, so optimal Recipe management for each customer is impossible.
If RPM is used and Max Power of RPS and actual power consumption are small, the power efficiency of RPS is increased by increasing the proper amount of NF3 Flow, and the generation of F Radical required during Chamber Clean is increased to increase the Clean Time. Can be improved and the overall Process Time can be reduced.
Recently, most FABs are changing RPS from a small capacity to a large capacity or increasing the NF3 flow rate in order to shorten the Cleanjin Time.
When installing the RPM, measure the power value of the installed RPS to find and maintain the optimum power level of the existing RPS without replacing the RPS capacity, and at the same time increase the NF3 Flow amount and shorten the Cleaning Time. You can
RPS auto-controls the output power value according to the amount of NF3 gas, pressure, and temperature.
However, most RPS does not display the Power value, so optimal Recipe management for each customer is impossible.
If RPM is used and Max Power of RPS and actual power consumption are small, the power efficiency of RPS is increased by increasing the proper amount of NF3 Flow, and the generation of F Radical required during Chamber Clean is increased to increase the Clean Time. Can be improved and the overall Process Time can be reduced.
Recently, most FABs are changing RPS from a small capacity to a large capacity or increasing the NF3 flow rate in order to shorten the Cleanjin Time.
When installing the RPM, measure the power value of the installed RPS to find and maintain the optimum power level of the existing RPS without replacing the RPS capacity, and at the same time increase the NF3 Flow amount and shorten the Cleaning Time. You can
Output power of RPS and dissociation rate
RPM 5kw Power Monitoring
RPM 7kw Power Monitoring
After upgrade, after Overhaul alarm occurs, Plasma on Fail cause
Systems Sequence
Mechanical configuration
Model configuration
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